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Doctoral Assistant |
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Microelectronic Systems Laboratory
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Yuksel Temiz
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Doctoral Program in Microsystems and Microelectronics
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BIOGRAPHY
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Yuksel Temiz received his B.S. and M.Sc. degrees in Electrical and Electronics Engineering from Middle East Technical University (METU), TURKEY, in 2005 and 2007, respectively, as the valedictorian. From 2005 to 2007, he worked as a research assistant at METU MEMS-VLSI Research Group (http://www.mems.eee.metu.edu.tr/) under the supervision of Prof. T. Akin. In this group, he studied on readout and control electronics for MEMS inertial sensors. He is now continuing his Ph.D. studies as a research/teaching assistant at Microelectronic Systems Laboratory (Prof. Y. Leblebici) and Laboratory of Life Science Electronics (Prof. C. Guiducci). In these groups, he is working on the development of CMOS biosensor arrays in 3D-integration technology. His main research interests are 3D-IC Technology, biosensors, microfabrication technologies, and interface electronics.
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MAIN PUBLICATIONS
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Design and Testing Strategies for Modular 3D-Multiprocessor Systems Using Die-level Through Silicon Via Technology, G. Beanato, P. Giovannini, A. Cevrero, P. Athanasopoulos, M. Zervas, Y. Temiz, and Y. Leblebici, IEEE Journal on Emerging and Selected Topics in Circuits and Systems, 2012 (submitted)
A CMOS Compatible Chip-to-Chip 3D Integration Platform, Y. Temiz, M. Zervas, C. Guiducci, and Y. Leblebici, Electronic Components and Technology Conference, 2012 (Accepted)
Wafer Level Deep TSV Fabrication and Electrical Analysis, M. Zervas, Y. Temiz, and Y. Leblebici, Electronic Components and Technology Conference, 2012 (Accepted)
3D Integration Technology for Lab-on-a-Chip Applications, Y. Temiz, S. Kilchenmann, Y. Leblebici and C. Guiducci, Electronics Letters, 2011
Resistive Programmable Through Silicon Vias for Reconfigurable 3D Fabrics, D. Sacchetto, M. Zervas, Y. Temiz, G. De Micheli, and Y. Leblebici, IEEE Transactions on Nanotechnology, 99, 2011
Microchannel-Based Liquid Interlayer Cooling in High-Performance 3D Stacks, Y. Temiz and Y. Leblebici, 16th IEEE European Test Symposium - Workshop on Low Power Design Impact on Test and Reliability, Trondheim, Norway, May 23-27, 2011
Die-Level TSV Fabrication Platform for CMOS-MEMS Integration, Y. Temiz, M. Zervas, C. Guiducci, and Y. Leblebici, Proceedings of the 16th International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers 2011), Beijing, China, 2011
Towards Thermally-Aware Design of 3D MPSoCs with Inter-Tier Cooling, M. Sabry, A. Sridhar, D. Atienza Alonso, Y. Temiz, Y. Leblebici, S. Szczukiewicz, N. Borhani, J. R. Thome, T. Brunschwiler, and B. Michel, Proceedings of Design, Automation and Test in Europe (DATE '11), Grenoble, France, 2011
Robust Microelectrodes Developed for Improved Stability in Electrochemical Characterization of Biomolecular Layers, Y. Temiz, A. Ferretti, E. Accastelli, Y. Leblebici, and C. Guiducci, Proceedings of the 9th Annual IEEE Conference on Sensors (Sensors'10), Hawaii, USA, 2010
Integrating Bio-sensing Functions on CMOS Chips, C. Guiducci, Y. Temiz, Y. Leblebici, E. Accastelli, A. Ferretti, G. Cappi, and E. Bianchi, Proceedings of Asia Pacific Conference on Circuits and Systems (APCCAS 2010), 2010
Validation of the Porous-Medium Approach to Model Interlayer-Cooled 3D-Chip Stacks, T. Brunschwiler, S. Paredes, U. Drechsler, and B. Michel (IBM), W. Cesar, G. Töral, Y. Temiz, and Y. Leblebici (EPFL), IEEE International Conference on 3D System Integration (3DIC), San Francisco, USA, September 2009
3D Architecture and Replaceable Layers for Label-Free DNA Biochips, Y. Temiz, S. Carrara, A. Cavallini, and Y. Leblebici, 3rd Int. Workshop on Advances in Sensors and Interfaces (IWASI09), Trani, Italy, June 2009
Real-Time High-Sensitivity Impedance Measurement Interface for Tethered BLM Biosensor Arrays, Y. Temiz, F. Gurkaynak, S. Terrettaz, H. Vogel, G. De Micheli, Y. Leblebici, C. Guiducci, and L. Benini, The 7th Annual IEEE Conference on Sensors (SENSORS08), Lecce, Italy, October 2008
A Compact Angular Rate Sensor System Using A Fully-Decoupled Silicon-On-Glass MEMS Gyroscope, S.E.Alper, Y.Temiz, T.Akin, IEEE Journal of Microelectromechanical Systems, Submitted
A Novel In-Operation High g-Survavible MEMS Gyroscope, K. Azgin, Y. Temiz, T. Akin, The 6th Annual IEEE Conference on Sensors (SENSORS07), Atlanta, Georgia, USA, October 28-31, 2007
An SOI-MEMS Tuning Fork Gyroscope with Linearly Coupled Drive Mechanism, K. Azgin, Y. Temiz, T. Akin, The 20th IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS 2007), pp. 607-610, Kobe, Japan, January 21-25, 2007
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Microfabrication Technologies
3D Integration
Biosensors
Analog Interface Electronics |
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