Jürgen Brugger

EPFL STI IMT LMIS1
BM 3107 (Bâtiment BM)
Station 17
1015 Lausanne

Web site:  Web site:  https://lmis1.epfl.ch/

EPFL STI IMX-GE
MXF 110 (Bâtiment MXF)
Station 12
1015 Lausanne

EPFL AVP CP CMI-CD
BM 3126 (Bâtiment BM)
Station 17
1015 Lausanne

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Administrative data

Fields of expertise

MEMS & Nanotechnology 
Micro/Nanomanufacturing
Cleanroom process training
Digital education using mixed reality

Professional course

Full Professor

EPFL-STI-IMT-LMIS1

EPFL

2016 to date

Associate Professor

EPFL-STI-IMT-LMIS1

EPFL

2009-2015

Assistant Professor

EPFL-STI-IMT-LMIS1

EPFL

2001-2009

Research Program Coordinator "NanoLink"

MESA Research Institute (Mentors: Jan Fluitman and David Reinhoudt)

University of Twente, The Netherlands

1998-2001

Postdoc and Research staff member

IBM Zuerich Research Laboratory (Mentor: Peter Vettiger)

1995-1998

Hitachi Research Fellow

Hitachi Central Research Laboratory Tokyo (Mentor: Ryo Imura)

1993-1994


Education

PhD

Physical-Electronics

Neuchatel

1995

Diplome (M.Sc.)

Electronique-Physique

Neuchatel

1990


Awards

ERC Advanced Grant

MEMS 4.0: Additive Micro-Manufacturing for Plastic Micro-Electro-Mechanical-Systems

2017

IEEE Fellow

"for contributions to micro and nano manufacturing technology"

2016

MNE Fellow

"in recognition of his contribution to the advancement of the field of MNE, in particular the development of innovative micro/nano manufacturing strategies for MEMS and Nanotechnology

2022

Teaching & PhD

Teaching

Microengineering

Courses

Introduction to additive manufacturing

The state of the art in the domain of additive production processes (the part is built by material addition without use of a shape tool) will be presented. The main application/benefits/shortcomings of the common additive processes as well as technological and economical issues will be discussed.

Microfabrication technologies

The student will learn process techniques and applications of modern micro- and nanofabrication, as practiced in a clean room, with a focus on silicon, but also multi-material microsystems and flexible/stretchable systems technologies.

Microfabrication practicals

The goal of this course is to introduce students to the practical aspects of some basic micro-fabrication techniques.

Advanced microfabrication practicals

(Coursebook not yet approved by the section)

Advanced additive manufacturing technologies

Advanced 3D forming techniques for high throughput and high resolution (nanometric) for large scale production. Digital manufacturing of functional layers, microsystems and smart systems.

MEMS practicals I

Objective of this practical is to apply in specific experimental settings the knowledge acquired in various MEMS related class

MEMS practicals II

Objective of this practical is to apply in specific experimental settings the knowledge acquired in various MEMS related class

Nanotechnology

This course gives the basics for understanding nanotechnology from an engineer's perspective: physical background, materials aspects and scaling laws, fabrication and imaging of nanoscale devices.

Soft Microsystems Processing and Devices

Amongst others, following topics will be covered during the course: - Soft Microsystems and Electronics - Electroactive polymers - Printed electronics and microsystems - Inkjet printing of polymers - Stretchable electronics - Mechanical reliability - Stencil lithography - Scanning Probe Lithography

MOOC: Micro and Nanofabrication (MEMS)

Micro- and nanofabrication can be taught to students and professionals by textbooks and ex-cathedra lectures, but the real learning comes from seeing the manufacturing steps as they happen. This MOOC will not only explain the basics of microfabrication but also show the practice through videos.

Advanced topics in micro- and nanomanufacturing: top-down meets bottom-up

This course introduces advanced fabrication methods enabling the manufacturing of novel micro- and nanosystems (NEMS/MEMS). Both top-down techniques (lithography, stenciling, scanning probes, additive techniques) and bottom-up approaches (self-assembly) are presented.